On the Age-Hardening Process of High Ag Content Cu-Pd-Ag Alloys
نویسندگان
چکیده
منابع مشابه
Sulfuration resistance of five experimental Ag-Pd-Au-Cu alloys with low Pd content of 10 or 12%.
Commercial Ag-based alloy (46Ag-20Pd-12Au-20Cu alloy) is widely used in Japan as a casting alloy. As opposed to the commercial composition, we prepared five experimental Ag-based alloys with reduced Pd content of 10 or 12%, increased Au content of 20 to 30%, and reduced Cu content of 12 to 20%. We then evaluated their sulfuration resistance by analyzing cast specimen surfaces dipped in 0.1% Na2...
متن کاملINFLUENCE OF THE Al CONTENT ON THE PHASE TRANSFORMATIONS IN Cu-Al-Ag ALLOYS
The literature about alloys of the Cu-Al system is extensive, due to its practical use. These alloys are of low cost and present good strength and hardness, depending on the Al content. They are used for making sleeves, guides, seats, flanges, gear wheels and many other critical small parts, as electrolysis cell cathodes, circuit plates and casting moulds when high thermal conductivity is neede...
متن کاملImprovements to the Microstructure and Physical Properties of Pd-Cu-Ag Alloys
3 Ordered Cu-(3550) at.% Pd alloys (B2-type superstructure) have a high corrosion resistance and are distinguished by possessing very low electrical resistivity r » (48) × 10 ohm m (1), two properties which make them of interest to researchers developing functional materials. However, wide-scale use of these alloys is hindered by their relatively poor strength properties: the yield stress of ...
متن کاملHigh Precision Ag Isotopic Measurements of Low Pd/Ag Meteorites
Introduction: The now extinct radionuclide Pd decays to Ag with a half life of 6.5Myr. Highly volatile element depleted (i.e. high Pd/Ag) Group IVA iron meteorites show good correlations between excess Ag and Pd/Ag. This strongly indicates the presence of live Pd at the start of the solar system [1]. Pd is both more refractory and more siderophile than Ag. Hence condensation/evaporation process...
متن کاملHigh-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications
Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and highAg-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC all...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Japan Institute of Metals and Materials
سال: 1981
ISSN: 0021-4876,1880-6880
DOI: 10.2320/jinstmet1952.45.3_221